TherMoiré PS600S

Flatness Measurement and Analysis SystemAkrometrix PS600


The TherMoiré PS600S is a metrology solution that utilizes the shadow moiré measurement technique combined with automated phase-stepping to characterize out-of-plane displacement for samples up to 600 mm x 600 mm. With time-temperature profiling capability, the TherMoiré PS600S captures a complete history of a sample's behavior during a user-defined thermal excursion.

The combination of the shadow moiré technique and dynamic temperature profiling is the foundation of the patented TherMoiré platform. Dynamic profiling is the most effective approach to analyze mechanical behavior induced by real-world processes and operating environments. Using the TherMoiré PS600S, engineers will gain a better understanding of the interactions of materials, packages, substrates and complete assemblies, allowing for a thorough analysis of the system, improving its reliability and operating performance. The PS600S is critical to helping meet the ever increasing interconnect and reliability requirements on both the device and substrate levels.

The PS600S is designed to meet the requirements of OEMs, PCB fabs and contract manufacturers who need large board/assembly characterization. With its 600 mm x 600 mm field of view, the PS600S is the largest temperature-dependent metrology tool available for the microelectronics industry.

The PS600S can be used in the laboratory:

  • Pb-Free processing implementation
  • Supplier performance and conformity monitoring
  • Pre-production mechanical behavior qualification
  • Evaluation of different materials and constructions
  • Failure/defect analysis
  • Failure/defect analysis
  • Validation of computer modeling
  • Reflow profile optimization
  • Evaluation of component-substrate seating plane interconnect